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Electron Microscopy Solutions

Process Development and Yield Ramp

A revolution in TEM imaging and metrology volumes

Time to market is becoming crucial for the commercial success of mobile electronic devices.  Time to yield is critical to generate the required return on investment  and commercial success of each product.  Yield analysis at many of the steps in the manufacture of a semiconductor device used to be monitored by visual or SEM based tool sets, but these are now increasingly dependent on feedback and metrology from TEM images.  FEI is enabling this transition from SEM to TEM with new high productivity tool workflows which provide the lowest possible cost per TEM sample.

Documents

High Volume and Fast Turnaround Automated Inline TEM Sample Preparation

Throughput and turnaround of current TEM sample preparation methods in the lab are limited due to the level of difficulty and process time required for producing TEM lamellae. To improve TEM sample preparation time, the plan view sampling techniques as well as cross sectional whole wafer TEM sample preparation by a DualBeam (FIB/SEM) system were introduced into the manufacturing environment.

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Products for Process Development and Yield Ramp

Themis S S/TEM for Semiconductors
The Themis S S/TEM is an 80–200kV scanning / transmission electron microscope (S/TEM) designed for high-speed imaging and analysis of semiconductor devices.
Helios G4 FX DualBeam for Semiconductors
The FEI Helios G4 FX DualBeam™ combines the industry-leading, highest-resolution Elstar+UC SEM with the most advanced Phoenix FIB for best-in-class imaging and milling performance. Added to this field-proven, fourth-generation Helios platform are the most advanced in situ lift-out and sample manipulation components, an innovative multiple gas delivery system, a dramatically improved 3Å-resolution, low-kV STEM detector, and customizable recipes, creating the most capable and flexible failure analysis instrument available today.
Helios G4 HX DualBeam for Semiconductors
The FEI Helios G4 HX DualBeam™ microscope combines the industry-leading, highest-resolution, highest-contrast Elstar+UC SEM with the most advanced Phoenix FIB for best-in-class imaging and milling performance. Specifically designed for high-throughput, high-quality, ultra-thin TEM lamella preparation, the Helios G4 HX DualBeam comes with the FEI EasyLift EX Nanomanipulator and new Automated QuickFlip shuttle for precise, accurate, and repeatable in situ sample lift-out and manipulations. When used in conjunction with the FEI iFast Starter Recipes for automated TEM sample preparation, even novice operators are able to repeatedly create high-quality, ultra-thin lamellas with confidence.
Helios G4 PFIB CXe DualBeam for Semiconductors

The Helios G4 PFIB CXe DualBeam™ System provides unique capabilities to enable advanced failure analysis of 3D packages and damage-free delayering of semiconductor devices, in addition to a wide range of other large area FIB processing applications.

Helios G4 PFIB HXe DualBeam for Semiconductors

The Helios G4 PFIB HXe DualBeam™ System provides unique capabilities to enable damage-free delayering of 10nm semiconductor devices and advanced failure analysis of 3D packages, in addition to a wide range of other large area FIB processing applications.

Helios G4 PFIB UXe DualBeam for Semiconductors

The Helios G4 PFIB UXe DualBeam™ System provides unique capabilities to enable damage-free delayering of semiconductor devices and advanced failure analysis of 3D packages, in addition to a wide range of other large area FIB processing applications.

OptiFIB Taipan Focused Ion Beam for Semiconductors
To meet the stringent circuit edit requirements of the 10nm node, the OptiFIB Taipan Focused Ion-Beam system was engineered to meet the challenges of advanced designs and processes. A new coaxial ion-photon column, electronics, chamber and stage enable a highly controlled beam profile and current, accurate navigation and ion beam placement, and reliable end-pointing. An updated chemical delivery system provides industry-leading etch and deposition chemistries.
Metrios TEM for Semiconductors
Advanced logic and memory manufacturing processes are becoming more reliant on fast turnaround of precise structural and analytical data to quickly calibrate tool sets, diagnose yield excursions and optimize process yields.  At technology nodes below 28nm, conventional SEM or optical based analysis and inspection tools cannot provide useful data. The FEI Metrios TEM automates the basic TEM operation and measurement procedures and minimizes the requirements for specialized operator training. Its advanced automated metrology routines deliver significantly greater precision than manual methods. The Metrios TEM is designed to deliver high volume TEM data, with accurate and repeatable operation - at the lowest cost-per-sample.
ExSolve WTP DualBeam for Semiconductors
The FEI ExSolve wafer TEM prep (WTP) DualBeam dramatically reduces the cost and increases the speed of sample preparation, providing semiconductor and data storage manufacturers with quick and easy access to the data they need to verify and monitor process performance.
V400ACE Focused Ion Beam for Semiconductors
The FEI V400ACE FIB is specifically designed to meet the challenges of advanced designs and processes: smaller geometries, higher circuit densities, exotic materials and complex interconnect structures. The V400ACE FIB can be configured for backside editing with an optional IR microscope and bulk silicon trenching package.

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