High Volume Manufacturing

A revolution in TEM imaging and metrology volumes

Producers of components for the consumer microelectronics industry face increasingly challenging processes which require very precise and repeatable yield control.  FEI produces dedicated workflow solutions which enable high performance yield characterization for the data storage and semiconductor markets.


High Volume and Fast Turnaround Automated Inline TEM Sample Preparation

Throughput and turnaround of current TEM sample preparation methods in the lab are limited due to the level of difficulty and process time required for producing TEM lamellae. To improve TEM sample preparation time, the plan view sampling techniques as well as cross sectional whole wafer TEM sample preparation by a DualBeam (FIB/SEM) system were introduced into the manufacturing environment.

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Products for High Volume Manufacturing

Metrios TEM for Semiconductors
Advanced logic and memory manufacturing processes are becoming more reliant on fast turnaround of precise structural and analytical data to quickly calibrate tool sets, diagnose yield excursions and optimize process yields.  At technology nodes below 28nm, conventional SEM or optical based analysis and inspection tools cannot provide useful data. The FEI Metrios TEM automates the basic TEM operation and measurement procedures and minimizes the requirements for specialized operator training. Its advanced automated metrology routines deliver significantly greater precision than manual methods. The Metrios TEM is designed to deliver high volume TEM data, with accurate and repeatable operation - at the lowest cost-per-sample.
ExSolve WTP DualBeam for Semiconductors
The FEI ExSolve wafer TEM prep (WTP) DualBeam dramatically reduces the cost and increases the speed of sample preparation, providing semiconductor and data storage manufacturers with quick and easy access to the data they need to verify and monitor process performance.
Helios NanoLab 460HP DualBeam for Semiconductors
Ideally suited for high throughput, high quality, ultra-thin TEM lamella preparation, the FEI Helios 460HP DualBeam™ comes with the EasyLift EX Nanomanipulator for in situ sample lift-out. When used in conjunction with FEI’s iFast Starter Recipes designed for either ex situ or in situ inverted sample preparation, even novice operators are able to create high-quality, ultra-thin lamella with tremendous confidence. The addition of the QuickFlip shuttle facilitates inverted sample thinning to eliminate curtaining in the region of interest. The combination of these unique features results in a >30% improvement in TEM lamella throughput over the Helios 450 DualBeam.

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