A revolution in high productivity TEM imaging, analysis and metrology

Consumer demand is driving the electronics market to produce faster, smaller, cheaper, more power efficient portable devices. Device manufacturers must place a high premium on both time-to-market and device performance . On an operational level, this means working with shrinking geometries, new materials and novel architectures.  At this level of innovation, critical dimensions are simply too small to see or characterize with existing tools.  New, high productivity, increasingly TEM-centric workflows are required to perform this work.

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Pathfinding / Device Development

Process Development & Ramp

High Volume Manufacturing

Electrical Failure Analysis

The most advanced DualBeam™ Plasma FIB platform for large area sample prep and analysis 

The Helios PFIB system combines the innovative Helios Elstar™ with UC technology electron column, for high-resolution, high-contrast imaging, with the high-performance Vion Xenon plasma ion column, for fast and precise large area sample cross-sectioning and deprocessing. 

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Featured Document

High Volume and Fast Turnaround Automated Inline TEM Sample Preparation

Throughput and turnaround of current TEM sample preparation methods in the lab are limited due to the level of difficulty and process time required for producing TEM lamellae. To improve TEM sample preparation time, the plan view sampling techniques as well as cross sectional whole wafer TEM sample preparation by a DualBeam (FIB/SEM) system were introduced into the manufacturing environment.

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