Introduction to Vion Plasma FIB
Introducing the Vion Plasma FIB from FEI. The Vion Plasma Focused Ion Beam system (PFIB) is especially well-suited for metals, composites, and coatings.
Innovative Plasma FIB Source Technology
The Vion PFIB uses a radically different ion source technology than that used in the vast majoirty of FIB based systems today (the gallium LMIS). This new ion source and column, developed by FEI, enables highly precise high-speed cutting and milling. In addition, the PFIB can selectively deposit patterned conductors and insulators. By combining high-speed milling with precise control, the system can be used in several ways in the development of manufacturing of semiconductor devices, such as:
- Failure analysis of bumps, wire bonds, TSVs, and stacked die
- Surgically remove material to enable failure analysis and fault isolate on buried die
- For process monitoring and development at die/package level
- Defect analysis of packaged parts and MEMS devices