Circuit edit technology provides rapid prototyping of small design corrections at various points in the IC manufacturing process: after first silicon debug; for performance enhancements during yield ramp; to create a small number of functioning chips for beta developers; and to resolve reliability issues. Circuit edit engineers mill the chip to the site of the suspected defect, and then remove or deposit conductors or insulators in precise geometries-allowing IC manufacturers to validate design changes without re-spinning masks and processing additional wafers.
To meet the stringent circuit edit requirements of the 10nm node , the FEI OptiFIB Taipan focused ion beam system was engineered to meet the challenges of advanced designs and processes. A new coaxial ion-photon column, electronics, chamber and stage enable a highly controlled beam profile and current, accurate navigation and ion beam placement, and reliable end-pointing. An updated chemical delivery system provides industry-leading etch and deposition chemistries.
- Imaging and milling resolution to meet 10nm node specifications
- Excellent navigation and ion beam placement accuracy to ensure high edit success rate at the 10nm node
- Superb etch selectivity and deposition control for conductors and insulators