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Electron Microscopy Solutions

Electrical Failure Analysis

Isolate subtle electrical issues that affect yield, performance, or reliability

Shrinking technologies, new materials, and more complex structures are driving defectivity, especially where the circuit design is particularly sensitive to process variation. These non-visual defects reveal themselves as electrical faults that downgrade device performance, threaten reliability, and destroy yield. The problem becomes even more complex when failures occur at the device packaging stage. High-density interconnects, wafer-level stacking, flexible electronics, and integral substrates mean that failure-inducing defects have more places to hide-making characterization more difficult, and more critical, than ever.

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Electron Microscopy Solutions

We have updated the appearance of FEI.com with the Thermo Fisher Scientific brand. This transition is an exciting moment as we continue to advance our world-leading electron microscopy solutions.