FEI's exclusive Plasma FIB DualBeam™ - Pushing the limits of extreme high-resolution and high-throughput characterization in 2D and 3D.
The Helios PFIB DualBeam features FEI's most recent advances in Plasma Focused Ion Beam and field emission SEM (FESEM) technologies and their combined use. FEI's first plasma-based DualBeam is designed for high-throughput, large-volume processing, combined with extreme high-resolution imaging in both 2D and 3D. For large-scale cross-sectioning, large-volume 3D data collection, or large-scale patterning, the Helios Plasma FIB DualBeam provides the highest quality of data in the shortest time.
PFIB prepared - 300um x 300um Cross-section of a 2.5D IC with Si Interposer