ExSolve WTP DualBeam for Semiconductors
The ExSolve WTP DualBeam system is an automated, high-throughput sample preparation system that can prepare site-specific, 20 nm thick lamellae on whole wafers up to 300mm in diameter. It is part of a fast, complete workflow that includes TEMLink™, and the Metrios™ TEM. The ExSolve DualBeam includes FOUP handling and is designed to be located in the fab near the manufacturing line.
The ExSolve WTP DualBeam workflow addresses the needs of customers that require automated, high-throughput sampling at advanced technology nodes. It complements the capabilities of the FEI Helios NanoLab™ DualBeam™ 1200AT, which provides more flexible, operator-directed, sample preparation methods, along with additional capabilities such as high-resolution scanning electron microscopy (SEM) imaging and analysis.
- ExSolve WTP DualBeam for Semiconductors