Subscribe for FEI Communications
You have successfully signed up for FEI newsletters.
First generation Helios with improved SEM for cross-section imaging and end point detection.
XHR SEM combined with new Tomahawk FIB for improved TEM sample prep and cross-section imaging.
Integrated hardware and automated recipes enable higher throughput, higher quality TEM sample prep.
First DualBeam to create sub 7nm thick TEM samples.
Helios G4 HX for Semiconductors
Helios G4 FX for Semiconductors
Helios G4 FX for Materials Science
Helios G4 UX for Materials Science
Helios G4 CX for Materials Science
All FEI Helios DualBeams