High Volume and Fast Turnaround Automated Inline TEM Sample Preparation
Throughput and turnaround of current TEM sample preparation methods in the lab are limited due to the level of difficulty and process time required for producing TEM lamellae. To improve TEM sample preparation time, the plan view sampling techniques as well as cross sectional whole wafer TEM sample preparation by a DualBeam (FIB/SEM) system were introduced into the manufacturing environment.
Please provide or confirm your information to download your document.
Your document has been downloaded. You will be taken back to your previous page in 4 seconds or
to go now.