Site-specific Analysis of Advanced Packaging Enabled By Focused Ion Beams (FIB)
Newer packaging technologies, such as, through-silicon-via, redistribution layer fan-in and fan-out, wafer-to-wafer and multi-chip stacks, require site-specific sectioning as part of process development, testing and failure analysis. These samples require much larger volumes of material to be removed than traditional FIB applications, so they are generally seen as being prohibitively time consuming for the FIB. New FIB capabilities are overcoming these limitations and enabling localized FIB sectioning to be applied to advanced packaging.
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