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Helios NanoLab™ DualBeam™

Helios NanoLab 650
Sample throughput and time to data are becoming increasingly important.  The FEI Helios NanoLab 50 series DualBeam  is unique in its ability to deliver the fastest TEM sample preparation performance in addition to providing highly flexible failure analysis capability on advanced (<20nm) semiconductor devices.  This SEM/FIB combines the most advanced scanning electron microscope (SEM) and focused ion beam (FIB) technologies with innovative gas chemistries, detectors and manipulators. Featuring unsurpassed SEM resolution, image quality and stunning Tomahawk™ FIB performance, imaging, milling or preparing samples is fast and easy for semiconductor and data storage labs, research facilities and industrial applications. 
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Helios NanoLab 450F1 Introducing the Helios NanoLab 450F1
The most flexible and capable Dualbeam ever created to address the many challenges faced by advanced Failure Analysis labs. By integrating FEI’s new EasyLift NanoManipulator and MultiChem Gas Delivery System with a new motorized Flipstage and STEM III detector, Semiconductor FA labs can now address a wider range of applications with just one system. The Helios 450F1 builds on the industry leading x50 platform which contains the highest resolution SEM and FIB available on the market.
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Helios NanoLab 450HP Helios NanoLab 450HP
The Helios NanoLab series is the world’s most advanced DualBeam platform for imaging, analysis, and TEM sample preparation in semiconductor failure analysis, process development and process control laboratories. All Helios NanoLab 50 series systems combine the innovative Elstar™ with UC technology electron column for high-resolution, high-contrast imaging with the high-performance Tomahawk™ ion column for fast, precise sample preparation.
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Helios NanoLab 600i Helios NanoLab 600i
The Helios NanoLab 600i builds on the success of FEI’s winning DualBeam series offering advances in the ion beam, electron beam, patterning and a range of features to make milling, imaging, analysis and sample preparation down to a nanoscale, standard applications in the lab.
Download the Helios NanoLab 600i Datasheet 
Helios NanoLab 650 Helios NanoLab 650
The Helios NanoLab 650 features FEI’s most recent advances in field emission SEM (FESEM) and focused ion beam (FIB) technologies and their combined use. As FEI’s 11th DualBeam platform, it is designed to access a new world of extreme high resolution (XHR) 2D and 3D characterization, 3D NanoPrototyping, and higher quality sample preparation.
Download the Helios NanoLab 650 Datasheet 
Discover Oil & Gas Solutions built on the Helios NanoLab 650 Dualbeam (link will launch a new window to fei-natural-resources.com)
Helios NanoLab 1200HP Helios NanoLab 1200HP
The development and ramp of shrinking geometries, new materials and novel device architectures are driving unprecedented volumes of TEM analysis. These samples must be ultra-thin, of the highest quality and generated in a routine and consistent manner across a fleet of tools. The Helios NanoLab 1200HP DualBeam is capable of producing sub 20 nm thick lamella samples while minimizing artifacts from preparation in exactly the right place all in a highly productive manner.
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  Electron
Beam
Ion Beam Chamber
Size
Helios NanoLab 450

Resolution:
-- 0.8 nm @ 15 kV
-- 0.9 nm @ 1 kV
Landing Voltage:
50 V - 30 kV
Probe current:
< = 26 nA
Maximum horizontal field width:
2.3 mm at beam coincident point (WD 4 mm)
Resolution:
 4.5nm @ 30 kV
Landing Voltage:
500 V - 30 kV
Probe current:
1.5 pA - 65 nA
Maximum horizontal field width:
1.0 mm at 5 kV at beam coincidence point
Maximum size (450):
100 mm diameter with full rotation
Maximum size (450S):
80 mm diameter with full rotation (larger samples possible with limited rotation)
Maximum thickness (via loadlock, standard shuttle, including stub or any kind of holder):
8.7 mm
Maximum thickness (via chamber door):
20 mm
Weight:
max 200 g (including sample holder) for specified performance
Vacuum:
< 2.6 * 10-6 mbar

Helios NanoLab 650  Resolution:
-- 0.8 nm @ 15 kV
-- 0.9 nm @ 1 kV
Landing Voltage:
50 V - 30 kV
Probe current:
<= 26 nA
Maximum horizontal field width:
2.3 mm at beam coincident point (WD 4 mm)
Resolution:
 4.5 nm @ 30 kV
Landing Voltage:
500 V - 30 kV
Probe current:
1.5 pA - 65 nA
Maximum horizontal field width:
1.0 mm at 5 kV at beam coincidence point
Maximum sample dimensions & width:
150 mm diameter with full rotation (larger samples possible with limited rotation)
Maximum clearance between stage and coincidence point:
55 mm
Weight:
max 500 g (including sample holder) for specified performance
Vacuum:
< 2.6 * 10-6 mbar

 

Upgrades & Accessories

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New Item
Featured Item

EasyLift NanoManipulator System

Works With: Versa 3D and Helios 450HP
EasyLift™ allows low-drift, high-precision movements to easily create traditional TEM lamella or ultra-thin lamella using the backside thinning technique. All EasyLift models are integrated with the microscope's xT software to provide a simple, intuitive method for lift-out and transfer of TEM samples to a grid, all within the DualBeam chamber. Compatible with the Helios 600i and 650.
New Item

MultiChem Gas Delivery System

Works With: Helios 600i, Helios 650, Helios 450HP, Helios 450F1
MultiChem™ is an advanced, compact Gas Delivery System developed by FEI, to perform beam induced direct deposition of structures and chemically enhanced etching of materials in an even more controlled and flexible way. A wide selection of chemistries, inherited from the years of gas injection (GIS) activity at FEI, are available and complemented with new ones.  Precise control of the deposition or etching process is achieved thanks to the fine gas flow and delivery design of the MultiChem.  Safe, straightforward and versatile operation is guaranteed by its full integration in the DualBeam. 

Acoustic Enclosure

Works With: Almost every SEM and Small DualBeam
The acoustic enclosure is a cover that fits the various pump(s) of the microscope system. It provides noise dampening of the pump(s) for operator and microscope. Check which enclosures we have available for your instrument.

Auto FIB

Works With: Versa 3D, V600, Helios, Nova NanoLab, Strata and Quanta 3D (FEG) Series
AutoFIB is a multi-site software automation package for FEI Small DualBeam (SDB) instruments. The package allows for unattended performing of FIB tasks after macro-recording. AutoFIB’s capabilities can be extended by application-specific automation software such as AutoTEM.

Auto TEM

Works With: Versa 3D, V600, Helios, Nova NanoLab, Strata and Quanta 3D (FEG) Series
AutoTEM is automation software for unattended TEM sample preparation by Focused Ion Beam Nano-machining. Throughput typically is two samples per hour depending on the required final thickness of the sample. The AutoTEM option requires Auto FIB, Platinum or Tungsten gas chemistry.

AutoSlice and View

Works With: Versa 3D, V600, Helios, Nova NanoLab, Strata and Quanta 3D (FEG) Series
Automation software for unattended serial sectioning and imaging through a site-specific volume of the specimen. The sequence of images can be merged into a video or be used as the input for 3-dimensional reconstruction of the volume subjected to the slice-and-view process.

Carbon Deposition

Works With: Nova NanoSEM, Nova NanoLab, Helios, Strata, Q3D(FEG) Series, V600FIB and Versa 3D
Gas chemistry solution (Naphthalene) for Ion or Electron beam deposition of Carbon-based material, mounted on any of the available GIS ports.

CoppeRx Kit

Works With: Nova NanoLab, Strata Series and Helios, V600FIB
Proprietary milling strategy to remove copper from sample surface 0.5 to 1.5 µm deep, and in patterns up to 40 x 40 µm.

CryoCleaner Extended Capacity

Works With: All SEM and DualBeam instruments, except full wafer systems
The CryoCleanerEC decontamination device for the SEM/SDB helps to reduce contamination found in the specimen chamber created by sample out-gassing and other sources common to SEM/SDB.

CryoMAT

Works With: Quanta™ 250, 450 and 650; Quanta 200, 400 and 600 (MK2 only); Quanta FEG 250, 450 and 650 • Quanta FEG 200, 400 and 600; Nova™ NanoLab 200, 600 and 600(i); Helios NanoLab™ 600; Quanta 3D 200i; Quanta 3D FEG and Versa 3D
The CryoMAT is a materials-dedicated, cryogenic upgrade to Quick Loader (loadlock system for SEM and DualBeam) and meets the demand for easier and more practical operation than a generic full cryo transfer system.
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More DualBeams:

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Discover MAPS

Mouse Cerebellum take on a Helios NanoLab DualBeam Microscope

High-throughput Correlative Workflow for DualBeams and SEMs

MAPS™ is a modular software package that turns your FEI scanning electron microscope (SEM) or DualBeam™ microscope into a high-throughput data production device.

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Changing the Properties of Light

The FOM Institute for Atomic and Molecular Physics’ (AMOLF) Center for Nanophotonics conducts nanophotonics using FEI's Helios NanoLab™ DualBeam™ system for the nanocharacterization and nanoprototyping of light-manipulating materials.

Read the case study