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Helios NanoLab™ DualBeam™

Helios NanoLab 650
Imaging, analysis and control of matter at the nanoscale — keys to future research and development — are routine with the Helios NanoLab™ 50 series DualBeam™ . This SEM/FIB combines the most advanced scanning electron microscope (SEM) and focused ion beam (FIB) technologies with innovative gas chemistries, detectors and manipulators. Featuring unsurpassed SEM resolution, image quality and stunning Tomahawk™ FIB performance, imaging, milling or preparing samples is fast and easy for semiconductor and data storage labs, research facilities and industrial applications.
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Helios NanoLab 450/450S Helios NanoLab 450S
The Helios NanoLab 450S is ideally suited for high throughput, high-resolution S/TEM sample preparation, imaging and analysis. Its exclusive FlipStage and in-situ STEM detector can flip from sample preparation to STEM imaging in seconds without breaking vacuum or exposing the sample to the environment.
Download the Helios NanoLab 450S Datasheet 
Helios NanoLab 600i Helios NanoLab 600i
The Helios NanoLab 600i builds on the success of FEI’s winning DualBeam series offering advances in the ion beam, electron beam, patterning and a range of features to make milling, imaging, analysis and sample preparation down to a nanoscale, standard applications in the lab.
Download the Helios NanoLab 600i Datasheet 
Helios NanoLab 650 Helios NanoLab 650
The Helios NanoLab 650 features FEI’s most recent advances in field emission SEM (FESEM) and focused ion beam (FIB) technologies and their combined use. As FEI’s 11th DualBeam platform, it is designed to access a new world of extreme high resolution (XHR) 2D and 3D characterization, 3D NanoPrototyping, and higher quality sample preparation.
Download the Helios NanoLab 650 Datasheet 
Discover Oil & Gas Solutions built on the Helios NanoLab 650 Dualbeam (link will launch a new window to fei-natural-resources.com)
Helios NanoLab 1200 Helios NanoLab 1200
The Helios family also includes the Helios NanoLab 1200, a full 300 mm wafer platform providing unmatched performance for larger samples where the need to maintain wafers intact is critical. FEI’s industry leadership in full wafer DualBeam technology now benefits from advanced electron and ion optics to bring unprecedented resolution to full wafer TEM (transmission electron microscope) sample preparation, defect characterization, and failure analysis.
Download the Helios NanoLab 1200 Datasheet 
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  Electron
Beam		 Ion Beam Chamber
Size
Helios NanoLab 450
 Helios NanoLab 450S

 Resolution:
-- 0.8 nm @ 15 kV
-- 0.9 nm @ 1 kV
Landing Voltage:
50 V - 30 kV
Probe current:
< = 26 nA
Maximum horizontal field width:
2.3 mm at beam coincident point (WD 4 mm)		 Resolution:
 4.5nm @ 30 kV
Landing Voltage:
500 V - 30 kV
Probe current:
1.5 pA - 65 nA
Maximum horizontal field width:
1.0 mm at 5 kV at beam coincidence point		 Maximum size (450):
100 mm diameter with full rotation
Maximum size (450S):
80 mm diameter with full rotation (larger samples possible with limited rotation)
Maximum thickness (via loadlock, standard shuttle, including stub or any kind of holder):
8.7 mm
Maximum thickness (via chamber door):
20 mm
Weight:
max 200 g (including sample holder) for specified performance
Vacuum:
< 2.6 * 10-6 mbar
Helios NanoLab 650  Resolution:
-- 0.8 nm @ 15 kV
-- 0.9 nm @ 1 kV
Landing Voltage:
50 V - 30 kV
Probe current:
<= 26 nA
Maximum horizontal field width:
2.3 mm at beam coincident point (WD 4 mm)		 Resolution:
 4.5 nm @ 30 kV
Landing Voltage:
500 V - 30 kV
Probe current:
1.5 pA - 65 nA
Maximum horizontal field width:
1.0 mm at 5 kV at beam coincidence point		 Maximum sample dimensions & width:
150 mm diameter with full rotation (larger samples possible with limited rotation)
Maximum clearance between stage and coincidence point:
55 mm
Weight:
max 500 g (including sample holder) for specified performance
Vacuum:
< 2.6 * 10-6 mbar
Helios NanoLab 1200  Resolution:
-- 0.9 nm @ 15 kV
-- 1.4 nm @ 1 kV
at optimum working distance
Accelerating Voltage:
350 V - 30 kV
Probe current:
<= 22 nA
Maximum horizontal field width:
1.5 mm at beam coincident point (WD 4 mm)		 Resolution:
5.0 nm @ 30 kV
Accelerating Voltage:
500 V - 30 kV
Probe current:
1.5 pA - 20 nA (15 position aperture strip)
Maximum  horizontal field width:
1.0 mm at 5 kV at beam coincidence point		 Maximum size:
Up to 300 mm diameter full wafers with full travel and rotation, wafer pieces up to 50 mm with small parts holder
Maximum thickness:
2 mm wafer thickness
Vacuum:
< 2.6 * 10-6 mbar

 

Upgrades & Accessories

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Acoustic Enclosure

Acoustic Enclosure

Works With: Almost every SEM and Small DualBeam
The acoustic enclosure is a cover that fits the various pump(s) of the microscope system. It provides noise dampening of the pump(s) for operator and microscope. Check which enclosures we have available for your instrument.
read more details »
Auto FIB

Auto FIB

Works With: Versa 3D, V600, Helios, Nova NanoLab, Strata and Quanta 3D (FEG) Series
AutoFIB is a multi-site software automation package for FEI Small DualBeam (SDB) instruments. The package allows for unattended performing of FIB tasks after macro-recording. AutoFIB’s capabilities can be extended by application-specific automation software such as AutoTEM.
read more details »
Auto TEM

Auto TEM

Works With: Versa 3D, V600, Helios, Nova NanoLab, Strata and Quanta 3D (FEG) Series
AutoTEM is automation software for unattended TEM sample preparation by Focused Ion Beam Nano-machining. Throughput typically is two samples per hour depending on the required final thickness of the sample. The AutoTEM option requires Auto FIB, Platinum or Tungsten gas chemistry.
read more details »
AutoSlice and View

AutoSlice and View

Works With: Versa 3D, V600, Helios, Nova NanoLab, Strata and Quanta 3D (FEG) Series
Automation software for unattended serial sectioning and imaging through a site-specific volume of the specimen. The sequence of images can be merged into a video or be used as the input for 3-dimensional reconstruction of the volume subjected to the slice-and-view process.
read more details »
Carbon Deposition

Carbon Deposition

Works With: Nova NanoSEM, Nova NanoLab, Helios, Strata, Q3D(FEG) Series, V600FIB and Versa 3D
Gas chemistry solution (Naphthalene) for Ion or Electron beam deposition of Carbon-based material, mounted on any of the available GIS ports.
read more details »
CoppeRx Kit

CoppeRx Kit

Works With: Nova NanoLab, Strata Series and Helios, V600FIB
Proprietary milling strategy to remove copper from sample surface 0.5 to 1.5 µm deep, and in patterns up to 40 x 40 µm.
read more details »
Cryo Can

Cryo Can

Works With: All SEM and DualBeam instruments, except full wafer systems
The Cryo Can decontamination device for the SEM/SDB helps to reduce contamination found in the specimen chamber created by sample out-gassing and other sources common to SEM/SDB.
read more details »
CryoMAT

CryoMAT

Works With: Quanta™ 250, 450 and 650; Quanta 200, 400 and 600 (MK2 only); Quanta FEG 250, 450 and 650 • Quanta FEG 200, 400 and 600; Nova™ NanoLab 200, 600 and 600(i); Helios NanoLab™ 600; Quanta 3D 200i; Quanta 3D FEG and Versa 3D
The CryoMAT is a materials-dedicated, cryogenic upgrade to Quick Loader (loadlock system for SEM and DualBeam) and meets the demand for easier and more practical operation than a generic full cryo transfer system.
read more details »
Delineation Etch

Delineation Etch

Works With: Nova NanoLab, Strata, Helios Series, Quanta 3D FEG and Versa 3D
Gas chemistry (TFA) solution for decoration of FIB-prepared cross-sections, preferably mounted on GIS port 1.
read more details »
EDX on DualBeam

EDX on DualBeam

Works With: All DualBeam tools
On every FEI microscope a wide range of EDX detectors can be operated. i.e. from suppliers like Oxford and Edax. FEI’s special integration kits prepare your SDB support computer to control the EDX in an integrated way. The required connection cards and kits are supplied by FEI together with the EDX solution selected.
read more details »
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More DualBeams:

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Discover MAPS

Mouse Cerebellum take on a Helios NanoLab DualBeam Microscope

High-throughput Correlative Workflow for DualBeams and SEMs

MAPS™ is a modular software package that turns your FEI scanning electron microscope (SEM) or DualBeam™ microscope into a high-throughput data production device.

Learn more

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Changing the Properties of Light

The FOM Institute for Atomic and Molecular Physics’ (AMOLF) Center for Nanophotonics conducts nanophotonics using FEI's Helios NanoLab™ DualBeam™ system for the nanocharacterization and nanoprototyping of light-manipulating materials.

Read the case study

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