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Helios NanoLab™ DualBeam™

Helios NanoLab DualBeam
Imaging, analysis and control of matter at the nanoscale — keys to future research and development — are routine with the Helios NanoLab™ DualBeam™ . This SEM/FIB combines the most advanced scanning electron microscope (SEM) and focused ion beam (FIB) technologies with innovative gas chemistries, detectors and manipulators. Featuring unsurpassed SEM resolution, image quality and stunning Sidewinder™ FIB performance, imaging, milling or preparing samples is fast and easy for semiconductor and data storage labs, research facilities and industrial applications.
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Outstanding imaging is standard with the Helios NanoLab's novel electron beam column, which builds on FEI's Titan™ electron optics and includes, along with a complete suite of detectors, a new imaging chain. It achieves superb contrast and resolution (sub-nanometer resolution at 15kV, and better than 1.5nm at 1kV). With the FIB, high-current and low-energy performance are superior and do not compromise the ultimate resolution of 5nm at 30kV.

The customized detectors integrated on the Helios NanoLab DualBeam  enable researchers to access precise topographic, chemical or crystallographic information from the sample. Combining automated FIB milling, SEM analysis and high-accuracy sample manipulation, the Helios NanoLab DualBeam is the preferred solution for acquiring high-resolution 3D data.

Relying on its advanced 16-bit digital pattern generator, the Helios NanoLab allows very fine and complex patterns to be written directly with the FIB. Direct deposition and enhanced etching rely on the advanced gas injection system (GIS) that meets advanced needs as varied as circuit editing or nanoprototyping.

Helios NanoLab is also unique because its automated sample preparation capabilities, using FEI's AutoTEM™ G2 software, yields thin samples that are prepared rapidly and with very high reliability. The Sidewinder FIB pioneers high-quality sample preparation using advanced endpointing and very low kV FIB cleaning—ideal for making localized samples (thinner than 50nm with damage thickness below 2nm) for observation in high-resolution S/TEMs.

The newest member of the Helios NanoLab family is the Helios NanoLab 1200 , a full 300 mm wafer platform leveraging the next generation capabilities of the current NanoLab tools. FEI’s industry leadership in full wafer DualBeam technology now benefits from advanced electron and ion optics to bring unprecedented resolution to full wafer TEM (transmission electron microscope)  sample preparation, defect characterization, and failure analysis.

Helios NanoLab DualBeam Product Brochure 
Helios NanoLab DualBeam for Semiconductor Applications 
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  Electron
Beam		 Ion Beam Chamber
Size
Helios NanoLab 600  Resolution:
-- 0.9 nm @ 15 kV
-- 1.4 nm @ 1 kV
Accelerating Voltage:
350 V - 30 kV
Probe current:
± 22 nA
Magnification:
1.5 mm at beam coincident point (WD 4 mm)		 Resolution:
5.0 nm @ 30 kV
Accelerating Voltage:
0.5 - 30 kV
Probe current:
1.5 pA - 20 nA
Magnification:
2.5 mm at 5 kV at beam coincidence point		 Maximum size:
150 mm diameter with full rotation (larger samples possible with limited rotation)
Maximum thickness:
20 mm (for 7 mm WD)
Vacuum:
< 2.6 * 10-6 mbar
Helios NanoLab 400
Helios NanoLab 400S

Resolution:
1.1 nm @ 15 kV2.5 nm @ 1 kV
Accelerating Voltage:
200 V - 30 kV
Probe current:
< = 20 nA in 21 steps
Magnification:
3.0 mm at beam coincident point (WD 5 mm)		 Resolution:
7.0 nm @ 30 kV (5.0 nm achievable)
Accelerating Voltage:
2 - 30 kV
Probe current:
1.5 pA - 20 nA (15 position aperture strip)
Magnification:
2.5 mm at 5 kV at beam coincidence point		 Maximum size:
150 mm diameter with full rotation (larger samples possible with limited rotation)
Maximum thickness:
20 mm (for 7 mm WD)
Weight - 500 g (including the sample holder)
Vacuum:
< 2.6 * 10-6 mbar
Helios NanoLab 1200  Resolution:
-- 0.9 nm @ 15 kV
-- 1.4 nm @ 1 kV
at optimum working distance
Accelerating Voltage:
350 V - 30 kV
Probe current:
± 22 nA
Magnification:
1.5 mm at beam coincident point (WD 4 mm)		 Resolution:
5.0 nm @ 30 kV
Accelerating Voltage:
0.5 - 30 kV
Probe current:
1.5 pA - 20 nA (15 position aperture strip)
Magnification:
2.5 mm at 5 kV at beam coincidence point		 Maximum size:
Up to 300 mm diameter full wafers with full travel and rotation, wafer pieces up to 50 mm with small parts holder
Maximum thickness:
2 mm wafer thickness
Vacuum:
< 2.6 * 10-6 mbar

 

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Upgrades & Accessories

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NanoArchitect
New Item
Featured Item

NanoArchitect

Works With: Helios NanoLab DualBeam, Nova NanoLab DualBeam
Additional NanoArchitect license that allows the planning of patterning sequences on an additional desktop PC.
read more details »
NanoBuilder
New Item
Featured Item

NanoBuilder

Works With: Helios NanoLab, Nova NanoLab
FEI NanoBuilder is a tool for systematic planning of construction of multi-layer nanostructures by dividing CAD files into ordered projects.
read more details »
NanoBuilder Time Limited License
New Item
Featured Item

NanoBuilder Time Limited License

Works With: Helios NanoLab, Nova NanoLab
FEI NanoBuilder™ is a tool for systematic planning of construction of multi-layer nanostructures by dividing CAD files into ordered projects. The Time-Limited License of NanoBuilder offers the full functionality of NanoBuilder for a limited time of 60 days.
read more details »
AutoSlice and View
Featured Item

AutoSlice and View

Works With: V600, Helios, Nova NanoLab, Strata and Quanta 3D (FEG) Series
Automation software for unattended serial sectioning and imaging through a site-specific volume of the specimen. The sequence of images can be merged into a video or be used as the input for 3-dimensional reconstruction of the volume subjected to the slice-and-view process.
read more details »
Carbon Deposition
Featured Item

Carbon Deposition

Works With: Nova NanoSEM, Nova NanoLab, Helios, Strata, Q3D(FEG) Series and V600FIB
Gas chemistry solution (Naphthalene) for Ion or Electron beam deposition of Carbon-based material, mounted on any of the available GIS ports.
read more details »
CoppeRx Kit
Featured Item

CoppeRx Kit

Works With: Nova NanoLab, Strata Series and Helios, V600FIB
Proprietary milling strategy to remove copper from sample surface 0.5 to 1.5 µm deep, and in patterns up to 40 x 40 µm.
read more details »
Cryo Can
Featured Item

Cryo Can

Works With: All SEM's and Small DualBeam's
The Cryo Can decontamination device for the SEM/SDB helps to reduce contamination found in the specimen chamber created by sample out-gassing and other sources common to SEM/SDB.
read more details »
Delineation Etch
Featured Item

Delineation Etch

Works With: Nova NanoLab, Strata, Helios Series and Quanta 3D FEG
Gas chemistry (TFA) solution for decoration of FIB-prepared cross-sections, preferably mounted on GIS port 1.
read more details »
EDX on DualBeam
Featured Item

EDX on DualBeam

Works With: All DualBeam tools
On every FEI microscope a wide range of EDX detectors can be operated. i.e. from suppliers like Oxford and Edax. FEI’s special integration kits prepare your SDB support computer to control the EDX in an integrated way. The required connection cards and kits are supplied by FEI together with the EDX solution selected.
read more details »
Enhanced Etch
Featured Item

Enhanced Etch

Works With: Nova NanoLab, Helios, Strata, Series and V600FIB
Gas chemistry solution (Iodine) for enhanced etching of metals and silicon, mounted on any of the available GIS ports.
read more details »
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Changing the Properties of Light

The FOM Institute for Atomic and Molecular Physics’ (AMOLF) Center for Nanophotonics conducts nanophotonics using FEI's Helios NanoLab™ DualBeam™ system for the nanocharacterization and nanoprototyping of light-manipulating materials.

Read the case study

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