DualBeam™ Systems
FIB/SEMs for sample prep and microanalysis
FEI's DualBeam™ (FIB/SEM) systems are the preferred solution for 3D microscopy and analysis serving material characterization, industrial failure analysis and process control applications. They are designed to deliver integrated sample preparation and microanalysis below 1nm for high throughput semiconductor and data storage fabs and materials science and life science labs.
FEI's offers a comprehensive line of DualBeam systems for electronics & life sciences.
Quanta
Our most versatile, DualBeam for 2D and 3D materials characterization and analysis, the Quanta 3D Series features three SEM imaging modes (high vacuum, low vacuum and ESEM) to accommodate the widest range of samples of any SEM. Integrated focused ion beam (FIB) adds cross sectioning capabilities to expand your applications range. ESEM mode allows in situ study of the dynamic behavior of materials at different humidity levels (up to 100% RH) and temperatures (up to 1500° C).
Helios NanoLab
The Helios NanoLab™ provides outstanding imaging with a novel electron beam column that includes, along with a complete suite of detectors, a new imaging chain that achieves superb contrast and resolution, while the focused ion beam's (FIB) superior performance provides fast milling and sample preparation applications.
DualBeam Systems for Electronics
Expida
The Expida™ Family offers two full wafer DualBeam microscopes with 300mm capability for fast and accurate 3D defect characterization, failure analysis and transmission electron microscope (TEM) sample preparation.
Certus 3D Wafer DualBeam
Data storage head manufacturers can increase established yields with precise structural measurements and imaging using the FEI Certus-3D Wafer DualBeam system. With full wafer auto-loading and critical 3D analysis of data storage devices in a clean room environment, the Certus-3D system shortens time to market by enabling critical engineering and development faster than other electron and/or ion-beam technologies. With its TEMLink™ 100 option, the Certus-3D system also can automate TEM sample preparation for higher-resolution imaging and analysis. The Certus-3D system uses programmable recipes for precise and repeatable location and milling of samples, wafer after wafer. Extracting the samples from wafers is automated by the FEI TEMLink™ system to reduce the time and risk associated with the lift-out process. Contact the FEI sales team for more information.
CLM-3D
The CLM-3D 300mm DualBeam is a full wafer autoloading system for automated, digital 3D analysis of semiconductor devices in a clean room environment. It combines FEI's latest generation electron column and high-current ion column to provide high precision cross-sectional metrology.
Defect Analyzer™ 300 HP
FEI's Defect Analyzer 300 HP delivers a powerful combination of tool automation, industry-leading electron imaging, unsurpassed focused ion beam milling, and proprietary beam chemistry technology to enable three-dimensional analysis of advanced process defects.