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DualBeam™ Instruments

FIB/SEMs for sample prep and microanalysis

FEI's DualBeam™ (FIB/SEM) systems are the preferred solution for 3D microscopy and analysis serving material characterization, industrial failure analysis and process control applications. They are designed to deliver integrated sample preparation and microanalysis below 1nm for high throughput semiconductor and data storage fabs and materials science and life science labs.

DualBeam systems for research, electronics, natural resources & life sciences.

Quanta 3D
Our most versatile DualBeam for 2D and 3D materials characterization and analysis, the Quanta 3D features three SEM imaging modes (high vacuum, low vacuum and Environmental SEM) to accommodate the widest range of samples of any SEM. Integrated focused ion beam (FIB) adds cross sectioning capabilities to expand your applications range. ESEM mode allows in situ study of the dynamic behavior of materials at different humidity levels (up to 100% RH) and temperatures (up to 1500° C).

Versa 3D
Building on the history and success of FEI's pioneering DualBeam, low vacuum and ESEM™ expertise, FEI introduces their most versatile DualBeam instrument to date. The Versa 3D offers state-of-the-art imaging and analytical performance to deliver a greater range of 3D data from even your most challenging samples.

Helios NanoLab
The Helios NanoLab™ provides outstanding imaging with a novel electron beam column that includes, along with a complete suite of detectors, a new imaging chain that achieves superb contrast and resolution, while the focused ion beam's (FIB) superior performance provides fast milling and sample preparation applications.

Certus-3D Wafer
Data storage head manufacturers can increase yields with precise measurements and imaging using the Certus-3D Wafer DualBeam system. The Certus-3D shortens time to market by enabling critical engineering and development faster than other electron and/or ion-beam technologies. With its TEMLink™ 100 option, the Certus-3D also can automate TEM sample preparation for higher-resolution imaging and analysis. The Certus-3D system uses programmable recipes for precise and repeatable location and milling, wafer after wafer.

CLM-3D
The CLM-3D 300mm DualBeam is a full wafer autoloading system for automated, digital 3D analysis of semiconductor devices in a clean room environment. It combines FEI's latest generation electron column and high-current ion column to provide high precision cross-sectional metrology.

CLM-3D Product Brochure	CLM+ Full Wafer DualBeam Datasheet
Defect Factory Options for CLM-3D	CLM Factory Automation Option

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Discover MAPS

High-throughput Correlative Workflow for DualBeams and SEMs

MAPS™ is a modular software package that turns your FEI scanning electron microscope (SEM) or DualBeam™ microscope into a high-throughput data production device.

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DualBeam™ and FIB capability applied to metals research

Discover the value of FEI DualBeam™ technology when applied to metals research, such as for coatings and stress analysis studied with indentations.

Read the PDF

FIB/DualBeam Techniques for Quantitative Analyses

The use of Focused ion beam (FIB) and combined FIB plus scanning electron microscope (SEM) dual platform instruments have continued to increase in popularity over the past decade in both the physical and biological sciences.

Read the Application Note

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