Scanning electron microscopy (SEM) has evolved to become a truly three-dimensional (3D), front-line investigation tool, fully independent of the sample's material properties, shape, surface characteristics, chemical nature, mechanical preparation history or electrical conductivity. Conventional SEM of a sample's surface can now be complemented and enhanced by real-time micro-sectioning precisely at the point of interest for immediate 3D information, without mechanical sample preparation.
Focused ion beam (FIB) technology provides an artifact-free method of site specific, real-time micro-cross-sectioning at the point of a mouse. These sections can pass straight through a target feature no larger than 100nm, leaving the exposed interior face of the selected feature undamaged and available for immediate imaging and characterization.
This process can be extended to provide a large number of automated, sequential cross-sectioning steps through a selected surface or embedded feature, (known as Slice&View) which collects image data over multiple sequential cross sections. The image data is then reconstructed into a volume representation or 3D view of your specimen for the ultimate in materials characterization techniques.
3D imaging presents image data as a volume rather than as a single plane, delivering extremely valuable information about the relative volumetric proportions of particles, inclusions, grains, or other material constituents within the sample. FEI's Quanta 3D DualBeam™ SEM/FIB has the ability to collect both 2D and 3D data, making it the ideal tool for 2D and 3D micro-characterization.