The need for TEM lamellae in the electronics market is becoming increasingly important as geometries shrink and new materials are introduced. The ability to create critically thin lamella for failure analysis and process characterization speeds time to data enabling faster product to market.
FEI's DualBeam™ systems deliver a powerful combination of tool process automation, industry-leading electron imaging, unsurpassed focused ion beam (FIB) milling and proprietary beam chemistry technology. These systems are uniquely suited for TEM lamellae preparation of advanced process defects and structural characterization providing critical data in the shortest time possible. FEI’s Multiloader solution enables secure, reliable handling of valuable TEM samples.
FEI instruments for TEM Lamella Preparation:
More Applications for Electronics
Semiconductor Device 3
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Learn how to prepare, extract, transfer and load TEM samples in 75 minutes, instead of 2.25 days.
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