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Electronics

Direct nano needle touch down on metallization of an integrated circuit taken using a Strata 400. Hagen Roetz, Infineon Technologies Dresden GmbH & Co. OHG

For Semiconductor, Solar and MEMS labs, and Data Storage production facilities, users can get to data faster, with the world's finest, most flexible suite of integrated imaging and analysis tools. FEI delivers superior images, faster sample preparation, more precise circuit editing and analysis—resulting in faster design validation and higher throughput process development and control.

Download Electronics Brochure 

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Getting higher-quality data, faster, speeds up time-to-market while enhancing yields. As process geometries shrink, the demands mount to increase yield, reduce cost, and accelerate time to high volume production. The need to adopt new tools and methodologies for finding and analyzing structures and defects is urgent, with a critical need for reliable, high-quality 3D characterization and metrology data.

Critical process data should be available in hours, not days. The superior products, quality of results and technology leadership from FEI can be trusted to help electronics companies accelerate their efforts to get to market and ramp to volume, with higher yields. Faster. 
Brochures: Datasheets: Application Notes & Whitepapers: Case Studies: Articles & Abstracts:

Events for Electronics


Event Event Type Date Location
PittconConference2010-03-01Orlando, FL
MICROSCIENCE 2010Conference2010-06-28London, England
IPFAConference2010-07-05Singapore
Microscopy & Microanalysis 2010Conference2010-08-01Portland, OR
International Microscopy CongressConference2010-09-19Rio de Janiero, Brazil
ISTFAConference2010-11-16Dallas, TX

Electronics Images

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Connectivity Solutions

Connectivity Solutions

An innovative new process that links the operations of sample preparation, lift-out, transfer, and loading of ultra-thin TEM lamellae for imaging and analysis.

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