Specialty tools for labs and fabs
The FEI V600FIB is the most efficient, flexible, and cost-effective circuit edit tool available for semiconductor labs. It enables fast, versatile modification and analysis with a single-column, focused ion beam (FIB) that effectively delivers high throughput circuit modification, cross-sectioning, and failure analysis.
Learn more about V600 [PDF 300KB]
Certus-3D™
Data storage head manufacturers can increase established yields and derive value from precise structural measurements and imaging using FEI’s Certus-3D. With full wafer auto-loading and critical 3D analysis of data storage devices in a clean room environment, the Certus-3D shortens time to market by enabling critical engineering and development faster than other electron and/or ion-beam technologies. Contact the FEI sales team for more information.
CLM-3D™
The CLM-3D 300 mm DualBeam (FIB/ SEM) is a full wafer autoloading system for automated, digital 3D analysis of semiconductor devices in a clean room environment. It combines FEI's latest generation electron column and high-current ion column to provide high precision cross-sectional metrology. By quickly providing critical feedback in-line, the CLM-3D delivers real-time process characterization or validation for use in optimizing front-end-of-line (FEOL) and back-end-of-line (BEOL) manufacturing processes.
Learn more about the CLM-3D [PDF 1099KB]
Defect Analyzer™ 300 HP
The Defect Analyzer 300 HP is built to accommodate transmission electron microscope (TEM) sample prep on 300 mm and 200 mm wafers. Because more than 80 percent of today's defects occur below the surface, the ability to locate and visualize defects critical to understanding costly yield excursions and improving fab performance.
Learn more about the Defect Analyzer 300 HP [PDF 1.4MB]
NanoLift™
The NanoLift is an in-situ sample lift-out, load-lock and transport mechanism used for transferring cartridges containing multiple transmission electron microscope (TEM) samples.
Learn more about the NanoLift™ [PDF 108KB]
Altura™ 855
FEI's Altura 855 offers the ultimate performance for defect characterization, failure analysis, and transmission electron microscope (TEM) sample preparation on patterned and unpatterned wafers, as well as wafer pieces and packaged parts.
Learn more about the Altura 855 [PDF 492KB]
Expida™ Family
Expida™ DualBeam™ systems from FEI improve process development and root cause analysis applications. The Expida family includes two full wafer DualBeam systems that accommodate near-fab semiconductor manufacturing support laboratories, and the 300mm full wafer capability of each microscope integrates flawlessly with inspection and control processes.
Learn more about the Expida Family