ExSolve WTP for Electronics
The ExSolve WTP system is an automated, high-throughput sample preparation system that can prepare site-specific, 20 nm thick lamellae on whole wafers up to 300mm in diameter. It is part of a fast, complete workflow that includes TEMLink™, and the Metrios™ TEM. The ExSolve includes FOUP handling and is designed to be located in the fab near the manufacturing line.
The ExSolve WTP workflow addresses the needs of customers that require automated, high-throughput sampling at advanced technology nodes. It complements the capabilities of FEI's Helios NanoLab™ DualBeam™ 1200AT, which provides more flexible, operator-directed, sample preparation methods, along with additional capabilities such as high-resolution scanning electron microscopy (SEM) imaging and analysis.